A team of engineering students from West Virginia University recently conducted soldering experiments aboard the Zero Gravity Corporation’s microgravity research aircraft, G-Force One. The team built upon work done by past WVU Microgravity Research Teams in an effort to remove bubbles or voids that form in solder joints when soldering is performed under microgravity conditions. According to team advisor John Kuhlman, professor emeritus of mechanical and aerospace engineering, the voids make the solder joints weaker and less electrically conductive than they would be if they were created within Earth’s normal gravity.